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Advanced Adhesives in Electronics Materials, Properties and Applications Alam

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Advanced Adhesives in Electronics

Materials, Properties and Applications

M O Alam (Edited by), C Bailey (Edited by)

9780081017326

Paperback / softback, published 19 August 2016

280 pages

23.4 x 15.6 x 1.9 cm, 0.4 kg

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adh]

Advanced Adhesives in Electronics Materials, Properties and Applications Alam

Advanced Adhesives in Electronics

Materials, Properties and Applications

M O Alam (Edited by), C Bailey (Edited by)

9780081017326

Paperback / softback, published 19 August 2016

280 pages

23.4 x 15.6 x 1.9 cm, 0.4 kg

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adh]

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